For factories engaged in 3C electronics packaging box processing, the most prominent recurring production defect lies in unstable adhesion of double-sided adhesive tape on paper packaging cartons.Printing and die-cutting residues, mold release agents and micro organic contaminants will reduce the surface tension of paper substrates. Conventional manual alcohol wiping cannot achieve standardized and consistent cleaning results, which directly causes adhesive peeling, edge warping and bubble generation after tape application, raising rework cost and finished product rejection rate severely.
Dongguan Keqi Automation Equipment Co., Ltd develops inline plasma cleaning & surface treatment module, which can be seamlessly retrofitted on existing automatic box pasting machines and tape applicator production lines.This plasma surface treatment system adopts targeted low-temperature plasma jet, performing molecular-level impurity removal and surface activation on the preset tape bonding area before laminating process. It effectively improves the surface energy of packaging paper, so that double-sided tape can form permanent tight bonding without damaging printed patterns and base paper materials.
Core Technical Advantages
- On-line integrated installation, no independent workstation occupation, optimizing workshop space utilization
- Continuous working design matches high-speed packaging line operation, suitable for mass batch production of phone back shield packaging boxes and electronic accessory cartons
- Modular structure supports customized transformation according to different models of automatic gluing and pasting equipment
As a professional manufacturer of industrial plasma surface treatment equipment and tape laminating automation machinery, Keqi provides free sample testing, on-site line modification and long-term after-sales technical support.If your packaging production line is plagued by tape degumming problems, feel free to contact our team for a tailored process optimization plan.