Created on 07.23

Low-Temperature Resistant Hot Melt Glue for Logistics Packaging

Logistics and cold chain packaging faces complex temperature changes, putting forward high requirements for adhesive environmental adaptability. Low-temperature resistant hot melt glue is specially developed for cold climate and cold chain logistics packaging scenarios. It will not become brittle, crack or lose adhesion in low-temperature environments, solving the common degumming problem of ordinary adhesives in winter and cold storage environments. It is suitable for sealing cold chain food cartons, logistics turnover boxes and outdoor shipping packaging. The glue layer retains excellent flexibility and bonding toughness under low temperature conditions, resisting external extrusion and vibration during long-distance transportation. It adapts to all-weather packaging operation for logistics enterprises, ensuring packaging integrity and avoiding cargo loss caused by packaging failure.

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