Cold Glue System Application on 3C Electronic Product Packaging

Mobile phone, charger, earphone and electronic accessory packaging mostly use coated art paper, aluminized paper and composite laminated cardboard. These materials are sensitive to high temperature; hot melt glue risks scalding surface printing. Keqi low-temperature cold glue becomes the mainstream bonding choice for 3C packaging lines.

After plasma surface activation, cold glue sticks firmly to smooth laminated carton surfaces, eliminating delamination during product assembly and transportation. Multi-nozzle cold glue guns realize multi-point gluing on irregular electronic box structures. Glue amount is precisely controlled to avoid glue seepage contaminating internal electronic accessories.

The equipment supports high-speed linkage with folder gluers, stable for mass orders of electronic brands. Parameter memory shortens debugging time when switching different electronic model boxes. Compared with hot glue, cold glue lowers workshop fire risk and adhesive cost, widely adopted by 3C packaging converters.SEO Keywords：