Low Pressure Hot Melt Gun For Delicate Thin Substrate Packaging

Keqi low pressure hot melt gun lowers internal glue conveying pressure to avoid substrate piercing and deformation on thin art paper, coated gift boxes and thin plastic blisters. Gentle glue output prevents paper wrinkling or transparent film breakdown during high-speed gluing.

The optimized needle valve sealing structure achieves zero dripping under standby status, eliminating glue stains on delicate printed packaging. Heating power is matched for low-viscosity hot melt to reduce thermal damage to UV coating and metallic printing layers. It fits cosmetic mini boxes, medicine blister packs and high-end thin paper gift packaging. Independent temperature control separates gun heating from main melter, supporting customized heating parameters for low-temperature sensitive adhesives.