Low‑Pressure Hot‑Melt Gun – Stable Dot Dispensing for Delicate Packaging Materials

Keqi low‑pressure hot‑melt gun focuses on precise dot‑pattern hot‑melt dispensing for thin, easily‑damaged packaging substrates. It reaches over 7000 cycles per minute, supporting EVA, PSA, TPR adhesives within 500‑5000 mPa.s viscosity range.Compared with standard high‑pressure glue guns, this model optimizes internal pressure structure to avoid excessive impact force that may dent or crease thin art‑paper and coated carton surfaces. Temperature adjustment covers 38‑230 °C, protected by Ni120 / PT100 temperature sensors against over‑heating and glue carbonization.

Compact body size brings flexible installation space on narrow folder‑gluer stations. The 24 VDC solenoid valve delivers instant on‑off action for clean dot cutoff without glue tails. Simple mechanical layout lowers maintenance barriers for front‑line workshop operators.It is widely applied for small cosmetic boxes, medicine cartons and thin‑paper gift packaging. Factories gain accurate dot‑gluing positioning while preventing substrate deformation.

The low‑pressure gun can be matched with Keqi hot‑melt pumps to build cost‑effective inline dot‑gluing workflows for mixed‑batch high‑value packaging.