This Keqi low-pressure hot melt glue gun is engineered for ultra-high-speed precision dot dispensing, adopting a compact slim body design that saves installation space on automated equipment. Controlled by a responsive 24VDC solenoid valve with only 12W power consumption, it supports a maximum operating frequency over 7000 cycles per minute to match high-speed folder gluer and assembly lines. Dual temperature sensors Ni120 and PT100 are equipped for accurate constant temperature monitoring, with a wide adjustable temperature range of 38°C to 230°C to fit various hot melt adhesive formulas.

It features mild working air pressure ranging from 4.5–5.5 bar (65–80 psi), effectively reducing impact force on thin, heat-sensitive packaging substrates while bearing maximum adhesive pressure up to 90 bar and hydraulic pressure below 103 bar. Compatible adhesives cover EVA, PSA and TPR hot melts with viscosity from 500 to 5000 mPa.s, covering most medium and low-viscosity industrial glues.

The modular integrated structure allows flexible horizontal and vertical mounting on jigs, robotic arms and printing machinery. It runs on universal 220VAC ±10%, 50/60Hz wide-frequency power supply suitable for global factories. Internal valve components are made of wear-resistant alloy, ensuring stable long-term high-frequency operation with low failure rate and extended service life.

The low-pressure hot melt glue gun is a precision dotting accessory mainly targeted at packaging and printing industries, specially designed for high-speed fine dot gluing on fragile, thin packaging materials. For gift box, wine box, cosmetic carton and food packaging production, it dispenses tiny neat glue dots on coated paper, UV coating and PET film surfaces without scratching printed patterns or denting thin substrates, matching high-speed automatic folder gluer lines.

It is widely extended to light industrial precision assembly scenarios, including small toy component fixing, electronic micro-part bonding, filter element edge sealing and lightweight non-woven fabric lamination. The low-impact dispensing performance makes it ideal for heat-sensitive and thin substrates that cannot bear strong high-pressure glue impact.

It can perfectly match Keqi pneumatic heating pumps and gear-type heating pump hosts, supporting multi-gun synchronous dotting systems for multi-station automation lines. Thanks to its slim mounting size, it can be installed on robotic arms, roll-to-roll machines and compact production jigs flexibly. It is the optimal upgrade choice for packaging factories troubled by thin material deformation, glue dot inconsistency and low line speed with traditional high-pressure glue guns.

The core advantage of this low-pressure dispensing gun lies in its mild low-air-pressure operation system, which avoids punching, scratching or deforming thin coated paper, UV-laminated films and lightweight plastic packaging, perfectly solving material damage problems caused by high-pressure standard glue guns. Its ultra-high cycle speed exceeding 7000 cycles per minute greatly boosts production throughput for mass packaging workshops without sacrificing dot precision.

Compact mini-size design brings flexible layout in narrow installation spaces of automated equipment, realizing multi-gun dense arrangement for multi-station synchronous gluing. Dual high-precision temperature sensors stabilize glue viscosity to produce uniform tiny glue dots with clean cutoff, eliminating glue stringing, tailing and overflow to cut adhesive waste and defective rates.

It supports multiple mainstream hot melt glue types with wide viscosity adaptability, realizing one gun for multiple production processes. Low-power 12W solenoid valve reduces daily power consumption for long-time continuous running. Compared with conventional high-pressure glue guns, it generates less equipment vibration and noise, lowers wear on matching host pump systems, and reduces long-term maintenance and spare part costs, delivering balanced comprehensive cost performance for precision packaging manufacturers.